a - 2005 23 - jun LEG2062 ligitek electronics co.,ltd. property of ligitek only LEG2062 bipolar type led lamps data sheet doc. no : qw0905- rev. : date :
1/6 page LEG2062 part no. package dimensions ligitek electronics co.,ltd. property of ligitek only note : 1.all dimension are in millimeter tolerance is ? 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. 1 2 anode 1.5max 25.0min 2 1 1.0min + - 2.54typ 5.2 0.5 typ 4.2 3.0 4.0 cathode y,g e,h,y -60 x 100% 50% 75% 25% -30 x 100% 25% 050%75% 0 x 30 x 60 x directivity radiation
635 565 30 45 70 70 8.0 5.0 3.0 4.5 2.6 2.6 1.7 1.7 part no. l 10 2/6 page ligitek electronics co.,ltd. property of ligitek only unit g e symbol parameter absolute maximum ratings absolute maximum ratings at ta=25 j ma mw 120 120 100 100 g a 10 10 i fp pd power dissipation peak forward current duty 1/10@10khz ir reverse current @5v forward current i f ma 30 30 j -40 ~ +100 max 260 j for 5 sec max (2mm from body) tstg soldering temperature storage temperature tsol forward voltage @20ma(v) spectral halfwidth ??f nm luminous intensity @ ma(mcd) color part no material typical electrical & optical characteristics (ta=25 j ) typ. max. min. min. lens emitted orange white diffused LEG2062 gaasp/gap gap green note : 1.the forward voltage data did not including ? 0.1v testing tolerance. 2. the luminous intensity data did not including ? 15% testing tolerance. peak wave length f pnm viewing angle 2 c 1/2 (deg) operating temperature -40 ~ +85 t opr j LEG2062
1.0 relative intensity@20ma 0.0 0.5 wavelength (nm) 550 600 650 ambient temperature( j ) fig.5 relative intensity vs. wavelength fig.3 forward voltage vs. temperature forward voltage@20ma normalize @25 j -20 -40 0.8 1.0 0.9 1.1 1.2 0.5 relative intensity@20ma normalize @25 j -20 ambient temperature( j ) 80 60 40 20 0-40 100 0.0 80 60 02040 100 fig.4 relative intensity vs. temperature 2.5 1.5 1.0 2.0 3.0 page 4/6 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 100 forward current(ma) 0.1 1.0 10 1.0 1000 e chip relative intensity normalize @20ma 0.5 forward voltage(v) 2.0 3.0 4.0 5.0 1.0 0.0 1.5 1.0 2.0 2.5 forward current(ma) 10 100 1000 fig.2 relative intensity vs. forward current 3.0 ligitek electronics co.,ltd. property of ligitek only 700 750 eg2062 part no. l
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( j ) relative intensity@20ma wavelength (nm) forward voltage@20ma normalize @25 j fig.4 relative intensity vs. temperature ambient temperature( j ) relative intensity@20ma normalize @25 j typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage forward current(ma) page 5/6 forward current(ma) fig.2 relative intensity vs. forward current relative intensity normalize @20ma ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0 10 100 1000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40 -20 0 20 40 60 1.0 1.1 1.2 500 550 600 650 0.0 0.5 1.0 2.0 3.0 4.0 5.0 80 100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip LEG2062 part no.
part no. page 6/6 ligitek electronics co.,ltd. property of ligitek only reference standard mil-std-883:1008 jis c 7021: b-10 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 description test condition test item reliability test: 1.ta=105 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=-40 j? 5 j 2.t=1000 hrs (-24hrs, + 72hrs) the purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. low temperature storage test high temperature storage test 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, + 72hrs) operating life test this test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 1.ta=65 j? 5 j 2.rh=90 %~95% 3.t=240hrs ? 2hrs 1.t.sol=260 j? 5 j 2.dwell time= 10 ? 1sec. 1.ta=105 j? 5 j &-40 j? 5 j (10min) (10min) 2.total 10 cycles the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. solder resistance test thermal shock test high temperature high humidity test 1.t.sol=230 j? 5 j 2.dwell time=5 ? 1sec solderability test this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hous. this test intended to see soldering well performed or not. LEG2062
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